McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications
It enables the manufacturing of power modules with a Tjmax of over 200℃, contributing to improved reliability of chip bonding and overall cost reduction.
The lack of suitable solder materials has previously excluded high melting point lead-free solder from serious consideration, but this is finally changing. At the same time, there is a demand for bonding materials that can maximize the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. We are also focusing on the development of high thermal conductivity epoxy paste. The demand for improved reliability and cost-effective high-volume manufacturing (HVM) of die attach has never been higher. With environmentally friendly Argomax technology, it is possible to create low-pressure sintered die attachments based on highly engineered particles. Argomax creates silver bonds with very high thermal and electrical conductivity, providing high reliability and flexible bonding lines. It enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and reduced total costs. It can also accommodate the lead-free transition for high-reliability bonds. We offer a variety of pastes, films, and preforms tailored to specific applications.
- Company：セイワ 東京本社、関西支社、名古屋営業所、中国無錫 グループ会社 エレクトロン（長野県松本市）
- Price：Other
